So this is a higher level engineering question...
If one looks at the various frequency coordination software packages, Workbench, IAS, SIFM, etc. you find that different models of wireless have different spacing parameters. As a broad sweeping statement, it is accurate to say that the more expensive the product, the tighter you can pack them in.
What underlying engineering determines these spacing parameters?
To use an example, in Sennheiser G3, the EM300 and the EM500 have the same sensitivity, the same adjacent channel rejection, the same intermod attenuation and the same blocking according to the numbers in the brochures. Why then can I fit 32 500 systems in a 42 MHz bank and only 24 300 systems?
My gut reaction is something related to frequency stability keeping everything tighter, but I'm hoping others might be able to shed some light on what quantifiable parameters make the differences...
If one looks at the various frequency coordination software packages, Workbench, IAS, SIFM, etc. you find that different models of wireless have different spacing parameters. As a broad sweeping statement, it is accurate to say that the more expensive the product, the tighter you can pack them in.
What underlying engineering determines these spacing parameters?
To use an example, in Sennheiser G3, the EM300 and the EM500 have the same sensitivity, the same adjacent channel rejection, the same intermod attenuation and the same blocking according to the numbers in the brochures. Why then can I fit 32 500 systems in a 42 MHz bank and only 24 300 systems?
My gut reaction is something related to frequency stability keeping everything tighter, but I'm hoping others might be able to shed some light on what quantifiable parameters make the differences...